Proven Thin Film Deposition Technology for Demanding Materials
Thin film deposition in ultra high vacuum (UHV) environment is our business. We design and manufacture advanced thin film deposition systems for Molecular Beam Epitaxy (MBE), UHV Magnetron Sputtering and Pulsed Laser Deposition. Since the company was founded in 1989, DCA has installed more than 200 UHV systems around the world.
We are a Finnish company located in Turku, in the southwest corner of Finland. We offer our customers high quality Finnish design and workmanship. A large part of our business has always been building complex, custom design deposition systems. We utilize our custom design background in the manufacturing of our standard systems. Our design flexibility is valued by our customers. Many of our standard systems have started as a solution to a customer’s particular deposition process.
DCA is the world leader in oxide MBE. We have systematically developed our oxide technology, oxygen resistant substrate heating and oxygen resistant sources since 1993. Therefore many leading laboratories have chosen DCA oxide technology. Our compound semiconductor MBE systems are in use around the world, both in R&D and in epiwafer production. DCA is continuously developing new sources and other MBE components for advanced compound semiconductor epitaxy.
Our standard system range extends from small R&D systems with 10 mm x 10 mm sample size to multi-wafer 4 x 4″ and 200 mm MBE and sputtering systems. DCA was the first to introduce a true UHV cluster tool with a UHV robot for automatic wafer handling.